The report analyzes:
• MEMS ”Specific” Equipment like deep reactive ion etching (inkjet heads, accelerometers, and gyroscopes), sacrificial layer etching (pressure sensors, gyroscopes, accelerometers, DLP, microphones), dual-side alignment (backside etching of pressure sensors, wafer level packaging), thick resist coating…
• MEMS ”standard” equipments include: physical vapor deposition, chemical vapor deposition, dry etching, lithography… In 2003, the total MEMS equipment market, including R&D equipment, was about $440 million.
The market will grow to $650 million in 2005 and to $750 million in 2007.And also included in the report is the analysis of MEMS materials market (wafers, masks and chemicals), MEMS device markets (inertial MEMS devices, pressure sensors, inkjet heads, optical MEMS…), emerging MEMS device markets (MEMS microphones, RF MEMS, microbolometers…), integrated MEMS…