This report from Glennan Microsystems Inc.
& Yole Développement describes new developments and market opportunities for MEMS in harsh environments.Until recently, MEMS devices were limited to standard environment use (T° < 150 °C, non-aggressive chemical exposure, con-trolled pressure, e.g.).
Now, expanded ap-plications are possible using new materials such as silicon carbide (SiC) or Silicon-on-Insulator (SOI).
Compatible with stan-dard MEMS processes, SiC or SOI devices offer improved performance.