This report highlights the market drivers for 3D packaging technologies, the status of developments, how it will impact the semiconductor food chain.
It covers as well equipments market forecasts and technical analyses of the different solutions with extensive exclusive technical explanation, figures and abstracts.3D integration will affect the IC, MEMS and image sensors markets!Semiconductor chips face constant pressure for increased performances while still decreasing their size and at the same time their packages must be able to accommodate new functionalities.
The ever-expanding consumer electronics market is a particularly strong driver of packaging innovations such as 3D ICs.
Today wire bonding is limited in density and performances so 3D stacking with micro-vias (or TSV, “through-Si vias”) seems to be unavoidable in the future for miniaturization first and increased performances after.3D integration will use technologies originally developed for MEMS technology but for different markets.
In our report, we have analyzed that portable applications are a strong market driver for 3D integration.
Stacking memories, stacking memories and logic, image sensors with µP and FPGAs will be the first mass market applications.
In 2010, we forecast that 1 billion of Flash memories will be stacked with TSVs3D-ICs: the technical challenges are close to be overcome3D is the most “integrated” approach and is an enabling technology platform applicable to digital and mixed signal electronics, wireless, electro-optical, MEMS, sensors, smart imagers, displays and other devices.
There are however strong challenges.
They are: thermal management, reliable co-design and simulation tools, industrial wafer-to-wafer bonding tools, low-cost through-wafer via structures and via fill processes.
In our report we have analyzed and compared the different technical solutionsList of interviewed companies:3D-Plus, All-via, Amkor, ASE, ASM International, Dow Corning, E2V, EM Microelectronics, Fraunhofer IZM , Freescale, Fujikura, Fujitsu, Hymite, Hynix Semiconductor, IMEC, Infineon, Intel, Leti, Matsushita Electric Works, MEMSiC, Micron, MicroResist, NEC, Nokia, Philips Image Sensors, Philips Semiconductors, Rensselaer Polytechnic Institute, Samsung, Semitool, SensoNor, Silex, SPIL, STATSChipPac, STMicroelectronics, SÜSS microtec, Synova, Tessera, Texas Instruments, Tezzaron, TSMC, VTI Technologies, VTT Technology, Xintec, XSil, Ziptronix, Zycube