This report analyzes the worldwide markets for Advanced Electronic Packaging in Millions of US$.
The specific product segments analyzed are Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules.
The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), Latin America, and Rest of World.
Annual forecasts are provided for each region and product segment for the period of 2000 through 2010.
The report profiles 77 companies including many key and niche players worldwide such as Advanced Semiconductor Engineering Group, Amkor Technology, Inc., ASAT Holdings Limited, ASM International NV, ChipScale, Inc., Fairchild Semiconductor International, Motorola, Inc., NEC Electronics Corporation, Semtech Corporation, STATS ChipPAC Ltd., Tessera, Inc., Texas Instruments, Inc., and Toshiba America Electronic Components, Inc.